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"中国芯中国芯中国芯中国芯"研讨会研讨会研讨会研讨会

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Innovations Through
Partnerships
2006 "中国芯中国芯中国芯中国芯"研讨会研讨会研讨会研讨会
谭谭谭谭军军军军
ARM中国中国中国中国总裁总裁总裁总裁
2006年年年年12月月月月12日日日日, 北京北京北京北京.
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ARM Technologies
memorymemory
SoCSoC
Control Processors
System Level IP:
Data Engines
3D Processors
Fabric
Physical IP
Software IP
Development Tools
Connected Community
Enabling complete solutions
through Partnership
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3
The ARM Strategy Evolved
OEMs
O
E
M
s
O
E
M
s
Processors
Tools
Systems
and Physical IP
Software
APPS & OS
PARTNERS
TOOLS
PARTNERS
SILICON
PARTNERS
Helping our Partners to build better SoCs
faster and at lower total cost
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Semiconductor industry
outpaces rest of the
world economy
ARM IP Outpaces the industry
SIA, June '06
ARM partnership
outpaces rest of the
semiconductor industry
ARM
26%
Rambus
11%
Synopsys
6%Saifun
6%
MIPS
4%
Others
43%
Virage
4%Data source:
Gartner Dataquest, 2006
ARM IP
outpaces rest
of competition
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Non-Mobile
Mobile
Embedded/Microcontroller
0
50
100
150
200
250
300
350
400
450
500
550
600
Q 1 0 1
Q 2 0 1
Q 3 0 1
Q 4 0 1
Q 1 0 2
Q 2 0 2
Q 3 0 2
Q 4 0 2
Q 1 0 3
Q 2 0 3
Q 3 0 3
Q 4 0 3
Q 1 0 4
Q 2 0 4
Q 3 0 4
Q 4 0 4
Q 1 0 5
Q 2 0 5
Q 3 0 5
Q 4 0 5
Q 1 0 6
Q 2 0 6
Q 3 0 6
Driving Momentum: 4.5Bn Units by 2010
20062010
2bn / year
4.5Bn / year
Mobile 2x
Non-mobile 4x
Embedded 10x
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ARM and Partnership Evolution
2001
77 processor licensees
33 shipping 123 million/quarter
Physical IP revenue $6M/qtr
~$10M R&D spend/quarter
~$40B semiconductor
market/quarter
2006
187 processor licensees
69 shipping 620 million/quarter
Physical IP revenue $25M/qtr
~$25M R&D spend/quarter
~$60B semiconductor
market/quarter
Dramatic changes together in 5 years
Integrated IP and tools deliver better products
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ARM's Evolution in the Past Year
Investing in new technology through R&D and acquisition
Many new products and solutions including
Cortex -A8, NEON and Cortex-R4
Swerve Java 3D engine and TrustZone APIs
RealView Development Suite 3.0
AMBA Designer and Configurable AMBA 3 AXI PrimeCells
Three new companies acquired
Keil - MCU development toolchain
Falanx - 3D graphics engines
SOISIC - SOI physical IP technology
51 new Partners in the ARM Connected Community
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Market Driven Roadmaps
Roadmap Investment
> $100m p.a.
Roadmaps created by divisions from market input and innovation
Central
R&D
Product Definition
Project Approval
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SC100
ARM1026EJ-S
2005 2006
Worst case conditions
DMIPS
250
500
750
ARM926EJ-S
ARM11 MPCore
Cortex-A8
1000
ARM1176JZF-S
ARM1156T2F-S
2000
x4
ARM Cortex
Intelligent Computing
1500
2500
Processor Roadmap
Cortex-M3
Cortex-R4F
ARM7TDMI ARM968E-S
ARM996HS
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Next Generation of Product in the Home
ARMv6 architecture
ARM1176JZ-S Processor
750MHz
SIMD multimedia instructions
AMBA 3 AXI Memory System
TrustZone security
Java Performance
Transport
Stream
Demux
Video
Decode
ARM
1176JZ-S
PL341
DDRII
Memory
Control
Audio
Decode
ARM926EJ-S
Graphics
Display
ControlCA
Interface
Cortex
M3
AXI Bus Fabric
6
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Performance/Power Flexibility
90G Worst
320MHz
0.25mW/MHz
1.55sq mm
Advantage-HS
90G Worst case
620MHz
0.45mW/MHz
2.65sq mm
Mainstream Platform
Power
Performance
ARM1176JZ-S
ARM1176JZ-S
Performance Platform
Performance
Boost
Power/Area Reduction
Density Optimized Platform
All data estimated for full implementations
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Physical IP - 2006 Headlines
Solutions:
ARM Processor and Physical IP - 750 MHz
Performance (Jan)
Next generation DDR solutions (July)
Integrated reference methodologies, with
libraries and memories (July)
Customer Adoption:
Haier IC - Consumer Applications (Feb)
Samsung - 65nm low power (Feb)
IBM, Chartered, Samsung - 65nm (Feb)
IBM, Chartered, Samsung - 45nm (Oct)
TSMC - Long term agreement,
65nm and 45nm (April)
SMIC - 90nm low power and performance
platforms (May)
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Cortex-M3 for Microcontrollers
Higher efficiency
processor
Lower clock speeds
Greater determinism
Improved code density
Extended battery life
Efficient instruction set
Integrated sleep modes
Rapid resume from sleep
System peripherals
control
32-bit MCUs at 8-bit
prices
Minimal package

引用地址:http://www.wenhei.com/document/1198865/